top of page

Sample Preparation Equipment

Hitachi IM-3000 Flat-Ion Milling 

IM-3000 flat ion milling system | McGill Electron Microscopy Research Group

IM-3000 is a broad ion beam milling system for flat milling of pre-polished samples. Its 1 to 6 keV Ar+ ion beam ensures limited ion implantation and high sputtering rate. Ideal for metal and alloys prior to ECCI.

LKB Nova Ultramicrotome

LKB Nova Ultramicrotome | McGill Electron Microscopy Research Group

The LKB Nova ultramicrotome is used to prepare thin sections of soft materials of the order of 50-70 nm with a diamond knife. Perfect to prepare TEM/STEM lamella of polymers or biological materials. Does not offer the cryo option.

PIE Scientific Tergeo Plasma Cleaner

IMG_20231013_123345021_HDR_edited.jpg

The Tergeo EM plasma cleaner can be applied on bulk specimens as well as TEM/STEM specimens mounted on the SU-9000 sample holder. It can be used in direct mode to etch/clean samples or in remote mode for a more gentle cleaning (no etching) on TEM/STEM specimens or sensitive materials.

Hitachi IM-4000Plus Ion Milling 

IM-4000Plus is a broad ion beam milling system used for cross-sectioning and flat milling of various materials. It has optical systems to ensure perfect milling of surfaces and its range of acc.voltages from 1 to 6 kV, in combination to different modes of stage rotation make the IM-4000 the perfect tool for sample preparation prior to SEM. Note that it has also a air protection transfer system.

Technoorg-Linda UniMill

The UniMill broad ion beam milling system is a versatile ion polisher used to reach electron transparency on conductive specimens in the perspective of producing TEM/STEM thin specimens (3 mm). The two Ar+ guns allow high milling rates to remove quickly large layers of materials as well as low kV surface cleaning of redeposited materials and amorphized layers.

EMS Q150TS Sputter Coater/Evaporator

The Q150TS is the combination of a sputter coater and a carbon evaporator. Available targets for sputtering are: Chromium, nickel, gold, platinum. Minimum coating thickness is 1.5 nm for sputtering, 5 nm for C evaporation. Offers tilt and stage rotation.

EMS Dimpler D500i

The D500i dimpler from EMS allows to dimple 3 mm discs to reduce mechanically the specimen thickness in order to reduce the milling time to reach electron transparency of TEM/STEM samples.

bottom of page